Kinetic analysis of electroless deposition of copper

R Schumacher, JJ Pesek…

文献索引：Schumacher, R.; Pesek, J. J.; Melroy, O. R. Journal of Physical Chemistry, 1985 , vol. 89, # 20 p. 4338 - 4342

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被引用次数: 61

摘要

Kinetic data on electroless copper deposition from a formaldehyde/EDTA solution are analyzed and discussed in terms of a formal kinetic rate law. The derived rate equation shows first-order dependence on the methylene glycol anion and zeroth order on cupric ion. Kinetic preexponential factors evaluated from temperature dependencies of reaction rates indicate that the rate-determining step involves an adsorbed species. A primary kinetic ...