SLAP TA structure
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Common Name | SLAP TA | ||
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CAS Number | 2093935-86-3 | Molecular Weight | 177.38 | |
Density | 0.90452 | Boiling Point | 218.2±25.0 °C at 760 mmHg | |
Molecular Formula | C7H19NSSi | Melting Point | N/A | |
MSDS | N/A | Flash Point | 23.89 °C |
Use of SLAP TADescription When used with aliphatic or aromatic aldehydes, this silicon amine protocolSLAP reagent enables the photomediated synthesis of thiomorpholines and thiazepanes. For photocatalytic cross-coupling with this SLAP Reagent, Ir[(ppy)2dtbbpy]PF6(747769) is used with a recommended starting combination of Lewis acids Bi(OTf)3(633305) and Cu(OTf)2(283673) prior to subsequent substrate-specific optimization. This product was introduced in collaboration with theBode Research Groupand provides a tin-free alternative toSnAP(tin amine protocol) reagents and is well-suited for scale-up reactions. |
Name | SLAP TA |
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Synonym | More Synonyms |
Density | 0.90452 |
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Boiling Point | 218.2±25.0 °C at 760 mmHg |
Molecular Formula | C7H19NSSi |
Molecular Weight | 177.38 |
Flash Point | 23.89 °C |
Exact Mass | 177.100739 |
LogP | 2.01 |
Vapour Pressure | 0.1±0.4 mmHg at 25°C |
Index of Refraction | 1.466 |
RIDADR | UN1993C |
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Hazard Class | 3 |
3-(((Trimethylsilyl)methyl)thio)propan-1-amine |