Abstract The modification of flat semiconductor surfaces with nanoscale materials has been the subject of considerable interest. This paper provides detailed structural examinations of gold nanoparticles covalently immobilized onto hydrogen-terminated silicon surfaces by a convenient thermal hydrosilylation to form Si [BOND] C bonds. Gold nanoparticles stabilized by ω-alkene-1-thiols with different alkyl chain lengths (C 3, C 6, and C 11), with average ...