Suc-Ala-Phe-Lys-AMC
Modify Date: 2024-01-29 11:05:19
Suc-Ala-Phe-Lys-AMC structure
|
Common Name | Suc-Ala-Phe-Lys-AMC | ||
|---|---|---|---|---|
| CAS Number | 73207-91-7 | Molecular Weight | 621.68100 | |
| Density | N/A | Boiling Point | N/A | |
| Molecular Formula | C32H39N5O8 | Melting Point | N/A | |
| MSDS | N/A | Flash Point | N/A | |
Use of Suc-Ala-Phe-Lys-AMCSuc-Ala-Phe-Lys-AMC is a highly sensitive fluorogenic substrate for plasmin. Suc-Ala-Phe-Lys-AMC is also used for assaying gingipain K[1][2]. |
| Name | SUC-ALA-PHE-LYS-AMC |
|---|
| Description | Suc-Ala-Phe-Lys-AMC is a highly sensitive fluorogenic substrate for plasmin. Suc-Ala-Phe-Lys-AMC is also used for assaying gingipain K[1][2]. |
|---|---|
| Related Catalog | |
| Target |
others |
| References |
[1]. P A Pierzchala, et al. A new fluorogenic substrate for plasmin. Biochem J. 1979 Dec 1;183(3):555-9. |
| Molecular Formula | C32H39N5O8 |
|---|---|
| Molecular Weight | 621.68100 |
| Exact Mass | 621.28000 |
| PSA | 209.93000 |
| LogP | 3.69670 |