Phenyl ester epoxy curative hybrid of bisphenol A

Modify Date: 2024-04-03 16:39:35

Phenyl ester epoxy curative hybrid of bisphenol A structure	Common Name	Phenyl ester epoxy curative hybrid of bisphenol A
	CAS Number	1071466-61-9	Molecular Weight	392.48700
	Density	1.096g/mLat 25℃	Boiling Point	N/A
	Molecular Formula	C₂₅H₂₈O₄	Melting Point	N/A
	MSDS	Chinese USA	Flash Point	>110°C
	Symbol	GHS07	Signal Word	Warning

Name	[4-[1-(4-acetoxy-3-allyl-phenyl)-1-methyl-ethyl]-2-allyl-phenyl] acetate
Synonym	More Synonyms

Density	1.096g/mLat 25℃
Molecular Formula	C₂₅H₂₈O₄
Molecular Weight	392.48700
Flash Point	>110°C
Exact Mass	392.19900
PSA	52.60000
LogP	5.32010
Storage condition	2-8°C

MSDS(Chinese)

Symbol	GHS07
Signal Word	Warning
Hazard Statements	H315-H317-H319-H335
Precautionary Statements	P261-P280-P305 + P351 + P338
Hazard Codes	Xi
Risk Phrases	36/37/38-43
Safety Phrases	26-36-39
RIDADR	NONH for all modes of transport

MFCD22200539

Dayang Chem (Hangzhou) Co., Ltd.
China
Product Name: Phenyl ester epoxy curative hybrid of bisphenol A
Price: $Inquiry/100g $Inquiry/1kg $Inquiry/100kg $Inquiry/1000kg
Purity: 98.0%
Stocking Period: Inquiry
Contact: Ms Wang

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