Phenyl ester epoxy curative hybrid of bisphenol A structure
|
Common Name | Phenyl ester epoxy curative hybrid of bisphenol A | ||
|---|---|---|---|---|
| CAS Number | 1071466-61-9 | Molecular Weight | 392.48700 | |
| Density | 1.096g/mLat 25℃ | Boiling Point | N/A | |
| Molecular Formula | C25H28O4 | Melting Point | N/A | |
| MSDS | Chinese USA | Flash Point | >110°C | |
| Symbol |
GHS07 |
Signal Word | Warning | |
| Name | [4-[1-(4-acetoxy-3-allyl-phenyl)-1-methyl-ethyl]-2-allyl-phenyl] acetate |
|---|---|
| Synonym | More Synonyms |
| Density | 1.096g/mLat 25℃ |
|---|---|
| Molecular Formula | C25H28O4 |
| Molecular Weight | 392.48700 |
| Flash Point | >110°C |
| Exact Mass | 392.19900 |
| PSA | 52.60000 |
| LogP | 5.32010 |
| Storage condition | 2-8°C |
| Symbol |
GHS07 |
|---|---|
| Signal Word | Warning |
| Hazard Statements | H315-H317-H319-H335 |
| Precautionary Statements | P261-P280-P305 + P351 + P338 |
| Hazard Codes | Xi |
| Risk Phrases | 36/37/38-43 |
| Safety Phrases | 26-36-39 |
| RIDADR | NONH for all modes of transport |
| MFCD22200539 |