Advanced Materials (FRG) 2015-08-05

Flexible Lamination Encapsulation.

Min-Ho Park, Jin-You Kim, Tae-Hee Han, Tae-Sik Kim, Hobeom Kim, Tae-Woo Lee

Index: Adv. Mater. 27 , 4308-14, (2015)

Full Text: HTML

Abstract

A novel flexible encapsulation method (Flex Lami-capsulation) is reported, which can be applied in the roll-to-roll process for mass production of organic electronic devices. Flex Lami-capsulation is very simple, fast, and getter-free, and is as effective as glass encapsulation. Use of this method is feasible in large-area flexible displays and does not have the drawbacks of conventional encapsulation methods. © 2015 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.