Advanced Materials (FRG) 2011-12-08

A novel solution-stamping process for preparation of a highly conductive aluminum thin film.

Hye Moon Lee, Si-Young Choi, Kyung Tae Kim, Jung-Yeul Yun, Dae Soo Jung, Seung Bin Park, Jongwook Park

文献索引：Adv. Mater. 23(46) , 5524-8, (2011)

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摘要

A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.