A novel solution-stamping process for preparation of a highly conductive aluminum thin film.
Hye Moon Lee, Si-Young Choi, Kyung Tae Kim, Jung-Yeul Yun, Dae Soo Jung, Seung Bin Park, Jongwook Park
Index: Adv. Mater. 23(46) , 5524-8, (2011)
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Abstract
A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
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